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TechDebt 2020
Sun 28 - Tue 30 June 2020
co-located with ICSE 2020

Welcome to the TechDebt 2020 website.

Important:

June 29: We have uploaded all presenter videos to a shared Google drive, available here.

Technical debt describes a universal software development phenomenon: design or implementation constructs that are expedient in the short term but set up a technical context that can make future changes more costly or impossible. Software developers and managers increasingly use the concept to communicate key tradeoffs related to release and quality issues. The goal of this two-day conference is to bring together leading software researchers, practitioners, and tool vendors to explore theoretical and practical techniques that manage technical debt.

The Managing Technical Debt workshop series has provided a forum since 2010 for practitioners and researchers to discuss issues related to technical debt and share emerging practices used in software-development organizations. A week-long Dagstuhl Seminar on Managing Technical Debt in Software Engineering has produced a consensus definition for technical debt, a draft conceptual model, and a research roadmap.

To accelerate progress, an expanded two-day working conference format has become essential. The third edition of the TechDebt Conference will be held jointly with ICSE 2020 in Seoul, South Korea, on May 25-26, 2020. The conference is sponsored by ACM SIGSOFT and IEEE TCSE.

News

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Dates
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Sun 28 Jun
Times are displayed in time zone: (UTC) Coordinated Universal Time change

15:00 - 15:30: OpeningTechDebt 2020 at TechDebt
Chair(s): Clemente IzurietaMontana State University
15:00 - 15:30
Day opening
TechDebt 2020
Clemente IzurietaMontana State University
15:30 - 16:15: Keynote 1TechDebt 2020 at TechDebt
Chair(s): Matthias GalsterUniversity of Canterbury

The keynote includes a 30 minute talk followed by a 15 minute Q&A.

15:30 - 16:15
Talk
TechDebt 2020
Laurie WilliamsNorth Carolina State University
16:15 - 16:25: Break 1TechDebt 2020 at TechDebt
16:15 - 16:25
Break
TechDebt 2020
16:25 - 17:25: Understanding Managing Technical Debt in IndustryTechDebt 2020 at TechDebt
Chair(s): Fabian GilsonUniversity of Canterbury

Every paper talk includes a 15 minute talk followed by 5 minutes for Q&A.

16:25 - 16:45
Research paper
TechDebt 2020
Terese BeskerChalmers University of Technology, Sweden, Antonio MartiniUniversity of Oslo, Norway, Jan BoschChalmers University of Technology, Sweden
16:45 - 17:05
Research paper
TechDebt 2020
Vladimir MandićFaculty of Technical Sciences, University of Novi Sad, Nebojša TaušanINFORA Research Group doo, Robert RamačFaculty of Technical Sciences, University of Novi Sad
17:05 - 17:25
Research paper
TechDebt 2020
Boris Rainiero Perez GutierrezUniversity of Los Andes, Colombia, Cristian Camilo Castellanos RodriguezUniversidad de los Andes , Bogotá, Colombia, Dario CorrealAssociate Professor, Nicolli RiosFederal University of Bahia, Sávio FreireFederal University of Bahia and Federal Institute of Ceará, Rodrigo SpinolaUniversidade Salvador, Carolyn SeamanUniversity of Maryland Baltimore County
17:25 - 17:30: Break 2TechDebt 2020 at TechDebt
17:25 - 17:30
Break
TechDebt 2020
17:30 - 17:50: RetrospectiveTechDebt 2020 at TechDebt
Chair(s): Areti AmpatzoglouUniversity of Groningen

Every paper talk includes a 15 minute talk followed by 5 minutes for Q&A.

17:30 - 17:50
Research paper
TechDebt 2020
Reem Alfayez, Wesam Alwehaibi, Robert Winn, Elaine VensonUSC, Barry BoehmUniversity of Southern California

Mon 29 Jun
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15:00 - 15:45: Keynote 2TechDebt 2020 at TechDebt
Chair(s): Michael FeldererUniversity of Innsbruck

The keynote includes a 30 minute talk followed by a 15 minute Q&A.

15:00 - 15:45
Talk
TechDebt 2020
15:45 - 15:50: Break 3TechDebt 2020 at TechDebt
15:45 - 15:50
Break
TechDebt 2020
15:50 - 16:50: Experiences in IndustryTechDebt 2020 at TechDebt
Chair(s): Zadia CodabuxUniversity of Saskatchewan

Every paper talk includes a 15 minute talk followed by 5 minutes for Q&A.

15:50 - 16:10
Research paper
TechDebt 2020
16:10 - 16:30
Research paper
TechDebt 2020
16:30 - 16:50
Short-paper
TechDebt 2020
François GauthierOracle Labs, Alexander JordanOracle Labs, Australia, Paddy KrishnanOracle Labs, Australia, Behnaz HassanshahiOracle Labs, Australia, Jörn Guy Süß, Sora BaeOracle Labs, Australia, Hyunjun Lee
16:50 - 16:55: Break 4TechDebt 2020 at TechDebt
16:50 - 16:55
Break
TechDebt 2020
16:55 - 17:35: ToolsTechDebt 2020 at TechDebt
Chair(s): Laura MorenoColorado State University

Every paper talk includes a 15 minute talk followed by 5 minutes for Q&A.

16:55 - 17:15
Research paper
TechDebt 2020
Humberto Cervantes, Rick KazmanUniversity of Hawai‘i at Mānoa
17:15 - 17:35
Research paper
TechDebt 2020

Tue 30 Jun
Times are displayed in time zone: (UTC) Coordinated Universal Time change

15:00 - 16:00: Technical Debt in Source Code and QualityTechDebt 2020 at TechDebt
Chair(s): Matthias GalsterUniversity of Canterbury

Every paper talk includes a 15 minute talk followed by 5 minutes for Q&A.

15:00 - 15:20
Research paper
TechDebt 2020
15:20 - 15:40
Research paper
TechDebt 2020
Jie Tan, Daniel FeitosaUniversity of Groningen, Paris AvgeriouUniversity of Groningen, The Netherlands
15:40 - 16:00
Research paper
TechDebt 2020
Fabian GilsonUniversity of Canterbury, Miguel Morales, Moffat Mathews
16:00 - 16:10: Break 5TechDebt 2020 at TechDebt
16:00 - 16:10
Break
TechDebt 2020
16:10 - 17:10: New IdeasTechDebt 2020 at TechDebt
Chair(s): Michael FeldererUniversity of Innsbruck

Every paper talk includes a 15 minute talk followed by 5 minutes for Q&A.

16:10 - 16:30
Short-paper
TechDebt 2020
Ilaria Pigazzini, Francesca Arcelli FontanaUniversity of Milano-Bicocca, Valentina LenarduzziLUT University , Davide TaibiTampere University
16:30 - 16:50
Short-paper
TechDebt 2020
Marco CoutoHASLab/INESC TEC & Universidade do Minho, Rui PereiraHASLab/INESC TEC & Universidade do Minho & Universidade da Beira Interior, Daniel MaiaHASLab/INESC TEC & Universidade do Minho, João Saraiva
16:50 - 17:10
Short-paper
TechDebt 2020
17:10 - 17:15: Break 6TechDebt 2020 at TechDebt
17:10 - 17:15
Break
TechDebt 2020
17:15 - 18:00: Panel and Closing StatementsTechDebt 2020 at TechDebt
Chair(s): Clemente IzurietaMontana State University, Zadia CodabuxUniversity of Saskatchewan
17:15 - 18:00
Live Q&A
TechDebt 2020
Ipek OzkayaCarnegie Mellon Software Engineering Institute, David MorgenthalerIndeed, Nico Zazworka, Antonio MartiniUniversity of Oslo, Norway, Terese BeskerChalmers University of Technology, Sweden, Philippe KruchtenUniversity of British Columbia

Tools Track

The Third International Conference on Technical Debt will be held in Seoul, Korea, on May 25–26, 2020, collocated with ICSE 2020.

Technical debt is a metaphor that software developers and managers increasingly use to communicate key trade-offs between time to market and quality issues.

While other software engineering disciplines—such as software maintenance and evolution, refactoring, software quality, and empirical software engineering—have produced results relevant to managing technical debt, none of them alone suffice to model, manage, and communicate the different facets of the design trade-off problems involved in managing technical debt. Similarly, while many software engineering practices can be used to get ahead of technical debt, organizations struggle with managing technical debt routinely and strategically.

Tools play a critical role in understanding the management, monitoring, and measurement of technical debt in real-world situations. We invite researchers, practitioners and organizations to showcase new techniques, methods, and tools that can aid practitioners and decision makers in these critical tasks to participate in TechDebt 2020.

Submission types

Tools track accepts two types of submissions:

  • Tool presentation papers (up to 5 pages): describe innovative and original tools addressing technical debt issues or aiming at the management of technical debt. Submitted tool papers will be peer-reviewed and accepted submissions will be published in the conference proceedings. Tool papers need to include the subtitle “Tool presentation paper”.
  • Extended abstract (1-2 pages): Although extended abstracts are not peer reviewed, abstracts will be screened to ensure they meet the expectations of the tools track and are aligned with the overarching technical debt theme of the conference. Extended abstracts provide practitioners with an opportunity to showcase a tool-specific perspective.

Suggested content For both types of submissions, the program committee and chairs will look for:

  • The alignment to the overarching technical debt theme of the conference.
  • How the purpose of the tool is addressed and how validation experiences with practitioners have been planned or conducted (if applicable)

If a longer experience report is available, we suggest the authors consider submissions to the main track’s experience-reports category and submit a companion extended abstract focusing on the tool itself to this track.

Submission process

In EasyChair, on top of specifying the type of submission, indicate how you will participate in the conference session (you may select one or both):

  • Panel participant: In the panel discussion we will engage participants and audience on how the showcased tools help address technical debt challenges.
  • Tool demonstration: If you propose to showcase your tool or product from your organization, please let us know your power and space requirements. A dedicated demo session will be part of the Tools track.

All accepted papers will also have the possibility to bring a poster during the conference.

Papers must be submitted electronically via the TechDebtConf2020 EasyChair site. Submissions must be in PDF and conform to the ACM formatting guidelines applied for ICSE 2020. Submissions may not exceed the number of pages specified above (including all text, references and figures). Purchases of additional pages in the proceedings is not allowed.

Formatting instructions are available at https://www.acm.org/publications/proceedings-template for both LaTeX and Word users. LaTeX users must use the provided acmart.cls and ACM-Reference-Format.bst without modification, enable the conference format in the preamble of the document (i.e., \documentclass[sigconf,review]{acmart}), and use the ACM reference format for the bibliography (i.e., \bibliographystyle{ACM-Reference-Format}). The review option adds line numbers, thereby allowing referees to refer to specific lines in their comments.

The official publication date is the date the proceedings are made available in the ACM or IEEE Digital Libraries. This date may be up to two weeks prior to the first day of ICSE 2020. The official publication date affects the deadline for any patent filings related to published work.

Accepted papers must be presented in person at the conference by one of the authors. Accepted submissions will be published as part of the ICSE co-located events proceedings.

Important dates:

  • January 27: Tool presentation papers (up to 5 pages) submitted to EasyChair (Date extended to February 3rd, AoE)
  • February 20: Extended abstracts (up to 2 pages) submitted to EasyChair
  • March 2: Notification of acceptance or rejection
  • March 15: Camera-ready submission of final paper or extended abstract
  • March 17: Early Registration
  • May 25–26: Conference, panel and demos

Further inquiries

All inquiries may be directed to track chairs: Zadia zcodabux@cs.usask.ca or Fabian fabian.gilson@canterbury.ac.nz.

Call for Papers

The Third International Conference on Technical Debt (TechDebt 2020) will be held in Seoul, Korea, on May 25–26, 2020, collocated with the 42nd International Conference on Software Engineering (ICSE 2020).

Technical debt is a metaphor that software developers and managers increasingly use to communicate key trade-offs between time to market and software quality issues.

While other software engineering disciplines—such as software maintenance and evolution, refactoring, software quality, and empirical software engineering—have produced results relevant to managing technical debt, none of them alone suffice to model, manage, and communicate the different facets of the trade-off problems involved in managing technical debt. Similarly, while many software engineering practices can be used to get ahead of technical debt, organizations struggle with managing technical debt routinely and strategically.

TechDebt 2020 aims to bring together leading software engineering researchers and practitioners to explore theoretical and practical techniques for managing technical debt and to share experiences, challenges, and best practices.

The conference addresses all topics related to technical debt, including

  • Concept and scope of technical debt
  • The business case for technical debt management
  • Understanding causes and effects of technical debt
  • Organizational and management debt
  • Technical debt management within software life-cycle management
  • Technical debt and requirements engineering (including requirements debt)
  • Technical debt in design and architecture (including architectural debt)
  • Technical debt and testing
  • Technical debt and software evolution, maintenance, and aging (including documentation debt)
  • Analysis, visualization and measurement of technical debt
  • Economic models for describing or reasoning about technical debt
  • Techniques and tools for calculating technical debt principal and interest
  • Concrete practices and tools used to manage technical debt
  • Debt remediation and refactoring
  • AI and machine learning to manage technical debt
  • Technical debt in multi-cultural and distributed development
  • Technical debt and DevOps
  • Technical debt in software models
  • Technical debt and quality attributes, such as security (especially at run-time)
  • Technical debt in (ultra-) large-scale systems, ecosystems, platforms and product lines
  • Technical debt in data-intensive systems
  • Technical debt in distributed systems (including server-less, mobile, IoT)
  • Beyond software—technical debt in systems engineering
  • Exploratory studies of technical debt in practice
  • Success and failure stories of technical debt management
  • Replication of studies related to technical debt
  • Meta-studies on technical debt
  • Education and training related to technical debt

We invite submissions of papers to the Technical Track in any areas related to the theme and goal of the conference in the following categories:

  • Research Papers (up to 10 pages): innovative and significant original research in the field
  • Experience Papers (up to 10 pages): industrial experience, case studies, challenges, problems, and solutions
  • Education and Training Papers (up to 10 pages): experiences, approaches and tools for teaching topics in academic courses or industrial training (e.g., lesson plans, assignments)
  • Short Papers (up to 5 pages): position and future trend papers describing ongoing research or new results, descriptions or examples of problems and solutions in real-life settings that pose fundamental or characteristic challenges

If you would like to submit a tool demo or description of a tool (either to complement your submission to the Technical Track or as a separate submission), please refer to the Tools Track of TechDebt 2020.

Submissions must be original and unpublished work. Each paper submitted to the main Technical Track will undergo a rigorous review process by at least three members of the program committee.

TechDebt 2020 adopts a double-blind review process for the main Technical Track (only). Therefore, all submissions to this track have to fulfill the double-blind reviewing requirements. Any submission that does not comply with these requirements may be desk-rejected without further review.

Evaluation criteria:

  • Relevance: Submission must respond to Call for Papers.
  • Soundness: Are all claimed contributions supported by the rigorous application of appropriate research methods? Claims should be scoped to what can be supported, and limitations should be discussed.
  • Significance: Are contributions evaluated for their importance and impact with respect to the existing body of knowledge? The authors are expected to explicitly argue for the relevance and usefulness of the research and discuss the novelty of the claimed contributions through a comparison with pertinent related work.
  • Novelty: Is there sufficient originality in the contribution, and is it clearly and correctly explained with respect to the state of the art?
  • Replicability: Is there sufficient information in the paper for the results to be independently replicated? The evaluation of submissions will take into account the extent to which sufficient information is available to support the full or partial independent replication of the claimed findings.
  • Presentation Quality: Are results clearly presented? Submissions are expected to meet high standards of presentation, including adequate use of the English language, absence of major ambiguity, clearly readable figures and tables, and respect of the formatting instructions.

The weighting and relevance of the above criteria varies for paper types.

TechDebt 2020 would like to foster Open Science Practices to increase accessibility, reproducibility, and replicability of research.

Papers must be submitted electronically via the TechDebtConf2020 EasyChair site. Submissions must be in PDF and conform to the ACM formatting guidelines applied for ICSE 2020. Submissions may not exceed the number of pages specified above (including all text, references and figures). Purchases of additional pages in the proceedings is not allowed.

Formatting instructions are available at https://www.acm.org/publications/proceedings-template for both LaTeX and Word users. LaTeX users must use the provided acmart.cls and ACM-Reference-Format.bst without modification, enable the conference format in the preamble of the document (i.e., \documentclass[sigconf,review]{acmart}), and use the ACM reference format for the bibliography (i.e., \bibliographystyle{ACM-Reference-Format}). The review option adds line numbers, thereby allowing referees to refer to specific lines in their comments.

The official publication date is the date the proceedings are made available in the ACM or IEEE Digital Libraries. This date may be up to two weeks prior to the first day of ICSE 2020. The official publication date affects the deadline for any patent filings related to published work.

Excellent papers will be considered for a Best Paper Award and invited to submit an extended version of their paper to a Special Issue of Elsevier’s Information & Software Technology journal.

Important dates:

  • January 10, 2020: Abstracts submission to EasyChair
  • January 17, 2020: Papers submission to EasyChair
  • March 2, 2020: Notification of acceptance or rejection
  • March 15, 2020: Camera-ready papers
  • March 17, 2020: Early registration
  • May 25–26, 2020: Conference

Accepted Papers

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Register Here: Online Registration form

TechDebt 2020, held virtually on June 28-30, is co-located with the 42nd ACM/IEEE International Conference on Software Engineering (ICSE), held virtually from June 27th - July 19th.

We will e-mail a Zoom link to all registrants one week before the event. Please register with an e-mail you check frequently.

Speaker: Laurie Williams

Laurie Williams

Laurie Williams is a Distinguished Professor in the Computer Science Department of the College of Engineering at North Carolina State University (NCSU). Laurie is a co-director of the NCSU Science of Security Lablet sponsored by the National Security Agency and the NCSU Secure Computing Institute. Laurie’s research focuses on software security; agile software development practices and processes, particularly continuous deployment; and software reliability, software testing and analysis. In 2018, Laurie was named an IEEE Fellow for contributions to reliable and secure software engineering. Laurie is an ACM Distinguished Scientist and has received the ACM SIGSOFT Influential Educator Award. Laurie received her Ph.D. in Computer Science from the University of Utah, her MBA from Duke University, and her BS in Industrial Engineering from Lehigh University. She worked for IBM Corporation for nine years before returning to academia.

Keynote

Risk-based Security Technical Debt Reduction: When everything’s important, nothing gets done

Abstract

While engineers are increasingly aware of security requirements, in many organizations security remains the responsibility of “those security people” and is not tightly integrated into the development cycle. Productivity and feature goals can result in engineers focusing on deployment rather than on fixing non-critical security issues or on building security into a product, resulting in an increase of security technical debt. Attackers eagerly exploit the vulnerabilities lying in the security technical debt pile. Organizations can benefit from risk-based practices for shrinking this debt. This talk will present two research projects in which risk is being used to prioritize security mitigations. The first project is focused on reducing secrets and credentials that have been checked into a code base. The second project relates to the prioritization of patching the continuous onslaught of vulnerable components and libraries that comprise a product.

Speaker: Florian Deissenboeck

Florian Deissenboeck

Florian Deissenboeck received his doctorate from Technical University Munich for his work on software quality models. Since 2005 he has been an active member of the software engineering research community and was awarded with the Most Influential Paper Award at the International Conference on Program Comprehension 2015 and the International Conference on Software Maintenance and Evolution 2017. In 2009 he co-founded CQSE GmbH, a company that offers the software intelligence platform Teamscale as well as innovative services that that help its customers to evaluate, control and improve the quality of their software. As head of the software auditing services, he develops new approaches for software audits and analyzes grown software systems in various industries.

Keynote

Ultra Short Feedback Cycles in Software Development - From Quality Gates to Quality Doors

Abstract

Many software development processes rely on quality gates. However, these quality gates often do not work as expected since they are heavyweight and provide feedback too late. As a result, quality gates fail to assure quality and cannot stop the quality erosion of software. In this talk, I explain how recent developments in the area of code collaboration platforms (Github, Gitlab, Bitbucket, …) support a more lightweight and more effective type of quality gates: These “quality doors” enable ultra short feedback cycles to an extent that would have been inconceivable a few years ago. They are facilitated through recent innovations, e.g. infrastructure as code, but also integrate well-established methods like code reviews. First industry experiences give hope that through this approach, quality assurance finally becomes an integral part of the software development process instead of being an afterthought. On a side note, I explain why I stopped using the term “technical debt”.

Steering Committee

Paris Avgeriou, University of Groningen
Philippe Kruchten, University of British Columbia
Robert L. Nord, Carnegie Mellon Software Engineering Institute
Ipek Ozkaya, Carnegie Mellon Software Engineering Institute
Carolyn Seaman, University of Maryland Baltimore County

Technical Track Program Committee

Apostolos Ampatzoglou University of Macedonia
Francesca Arcelli Fontana University of Milano Bicocca
Paris Avgeriou University of Groningen
Muneera Bano Swinbourne University of Technology
Stephany Bellomo Software Engineering Institute
Stefan Biffl Vienna University of Technology
Xavier Blanc Université de Bordeaux
Jan Bosch Chalmers University of Technology
Magiel Bruntnik SIG
Frank Buschmann Siemens
Marcus Ciolkowski QAware
Neil Ernst University of Victoria
Javier Gonzalez Huerta Blekinge Institute of Technology
Heiko Koziolek ABB Corporate Research
Philippe Kruchten University of British Columbia
Valentina Lenarduzzi Tampere University
Jean-Louis Letouzey inspearit
Peng Liang Wuhan University
Antonio Martini University of Oslo
Ipek Ozkaya Carnegie Mellon Software Engineering Institute
Patroklos Papapetrou Elastic
Jennifer Perez Technical University of Madrid (UPM), Spain
Eltjo Poort CGI
Ken Power Cisco Systems
Derek Reimanis Montana State University
Klaus Schmid University of Hildesheim
Carolyn Seaman UMBC
Davide Taibi Tampere University
Eoin Woods Endava
Heeran Youn Samsung Electronics
Maria Teresa Baldassarre University of Bari

Tools Track Program Committee

Remco de Boer ArchiXL
Xavier Devroey TU Delft
Steven Fraser Innoxec
Sven Johann innoQ
Loup Meurice Rever SA
Czaba Nagy Università della Svizzera italiana, Switzerland and University of Szeged, Hungary
Roberto Verdecchia Vu University
Vadim Zaytsev Raincode Lab

TechDebt Conference

To accelerate progress, an expanded two-day working conference format has become essential. The inaugural edition of the TechDebt Conference was held jointly with ICSE 2018 in Gothenburg, Sweden, May 27–28, 2018. Researchers, practitioners, and tool vendors explored theoretical and practical techniques that manage technical debt.

Conference Program Proceedings
TechDebt 2019 ICSE Second International Conference on Technical Debt ACM digital library
TechDebt 2018 ICSE First International Conference on Technical Debt ACM digital library

Dagstuhl Seminar: Managing Technical Debt in Software Engineering

A week-long Dagstuhl Seminar on Managing Technical Debt in Software Engineering, April 17 – 22 , 2016, has produced a consensus definition for technical debt, a draft conceptual model, and a research roadmap.

International Workshop on Managing Technical Debt Series

The Managing Technical Debt workshop series has provided a forum since 2010 for practitioners and researchers to discuss issues related to technical debt and share emerging practices used in software-development organizations. Browse the workshop collections.

Workshop Presentations Proceedings Summary
MTD 2017 @ XP Ninth International Workshop on Managing Technical Debt ACM digital library Technical Debt in Agile Development: Report on the Ninth Workshop on Managing Technical Debt (MTD 2017), ACM SIGSOFT Software Engineering Notes, Volume 42, Issue 3, July 2017, pages 18-21.
MTD 2016 @ ICSME Eighth International Workshop on Managing Technical Debt IEEE Xplore Technical Debt: A Research Roadmap Report on the Eighth Workshop on Managing Technical Debt (MTD 2016), ACM SIGSOFT Software Engineering Notes, Volume 42, Issue 1, January 2017, pages 28-31.
MTD 2015 @ ICSME Seventh International Workshop on Managing Technical Debt IEEE Xplore Technical Debt: Broadening Perspectives Report on the Seventh Workshop on Managing Technical Debt (MTD 2015), ACM SIGSOFT Software Engineering Notes, Volume 41, Issue 2, March 2016, pages 38-41.
MTD 2014 @ ICSME Sixth International Workshop on Managing Technical Debt IEEE Xplore Technical Debt: Beyond Definition to Understanding Report on the Sixth International Workshop on Managing Technical Debt, ACM SIGSOFT Software Engineering Notes, Volume 40, Issue 2, March 2015, pages 32-34.
MTD 2013b @ ESEIW Fifth International Workshop on Managing Technical Debt N/A Technical debt at the crossroads of research and practice: report on the fifth international workshop on managing technical debt, ACM SIGSOFT Software Engineering Notes, Volume 39, Issue 2, March 2014, pages 31-33.
MTD 2013a @ ICSE Fourth International Workshop on Managing Technical Debt IEEE Xplore Technical debt: towards a crisper definition report on the 4th international workshop on managing technical debt, ACM SIGSOFT Software Engineering Notes, Volume 38, Issue 5, September 2013, pages 51-54.
MTD 2012 @ ICSE Third International Workshop on Managing Technical Debt IEEE Xplore Technical debt in software development: from metaphor to theory report on the third international workshop on managing technical debt, ACM SIGSOFT Software Engineering Notes, Volume 37, Issue 5, September 2012, pages 36-38.
MTD 2011 @ ICSE Second International Workshop on Managing Technical Debt ACM digital library Managing technical debt in software development: report on the 2nd international workshop on managing technical debt, held at ICSE 2011, ACM SIGSOFT Software Engineering Notes, Volume 36, Issue 5, September 2011, pages 33-35.
MTD 2010 First International Workshop on Managing Technical Debt N/A Managing Technical Debt in Software-Reliant Systems, FSE/SDP Workshop on the Future of Software Engineering Research, 2010.

Save the date: May 23-24*

Location: Madrid, Spain

Topics will be announced soon. In the meantime think about the hard and challenging research questions in our community:

  • TD will be managed as well as we now manage defects and new features
  • We have a clear, operational definition of “good enough”
  • We have a way to translate developer concerns to manager concerns
  • TD will be incurred intentionally most of the time
  • Projects that manage TD are efficient, effective and sustainable
  • The benefit of upfront architectural work (vs. emergent architecture) is proven
  • Tools support all aspects of TD management that are used by all stakeholders
  • TD-aware development is an accepted way of producing software
  • Architectural assessment is part of policy

Industry Participation !

TD depends on a healthy and collaborative partnership between academics and practitioners. Industry studies and new tool advances are critical

Questions? Use the TechDebt contact form.